Customised RFID combinations News | 19.06.2024
Limitations of standard inlays: The adhesive as the weak link in the factory
When digitising material flows using radio-frequency identification, process reliability in harsh industrial environments rarely fails due to the electronics themselves. The weak point is usually the physical connection to the component. Off-the-shelf RFID transponders and smart labels are almost exclusively fitted with simple standard adhesives at the factory. This is sufficient for clean, smooth surfaces in protected office environments.
However, conditions are very different in the production halls of heavy industry, vehicle manufacturing or the chemical industry. Here, labels come into contact with oily metal surfaces, extreme heat, coarse cast-surface dirt or sensitive paintwork. A standard adhesive fails mechanically under these thermal and chemical stresses. The label comes away, and the component is lost in the ERP system.
Flexibility without compromise: the S+P modular system
Following extensive testing, S+P Samson GmbH has developed a process-based method to reliably combine special adhesives and RFID technology. The use of a new, highly flexible machine unit in our production breaks the traditional chain of material selection.
The components – carrier film, RFID inlay and adhesive layer – can now be freely configured within the modular system to meet specific requirements. Customised special adhesives from our portfolio – designed for extreme adhesion to rough surfaces or for residue-free removal – are combined directly with the functional transponders during the ongoing production process. The result is bespoke RFID labels that are precisely tailored to the requirements of the respective system. This mechanical optimisation ensures long-lasting adhesion and thus guarantees seamless readability and availability of data within the material flow.


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